abstract |
A thermosetting resin composition useful for slot insulation purposes is disclosed, which includes: na liquid epoxy resin; na curing agent including an acid anhydride; na maleimide resin in an amount of 3-50 parts by weight per 100 parts by weight of the liquid epoxy resin; and nfinely divided wollastonite in an amount of 50-400 parts by weight per 100 parts by weight of the liquid epoxy resin. |