http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0412537-A2

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filingDate 1990-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43c29f96ef79274b7da59f9c610fc555
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4aa09f5bf18f942fc6b35ede6c8fb72b
publicationDate 1991-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0412537-A2
titleOfInvention Process and device for the treatment of chemico-mechanical publishing fabrics, particularly for semiconductor wafers
abstract In the case of chemomechanical polishing, in particular of semiconductor wafers, the removal and the geometric quality of the wafers decrease with increasing service life of the polishing cloth. This can be prevented in that after the polishing process the polishing cloth is processed in such a way that a pressure field is applied to the polishing cloth, essentially without mechanical stress, through which a treatment liquid is caused to flow through the interior of the polishing cloth and thereby residues generated during polishing are mobilized and removed. A base plate (4) placed transversely over the polishing cloth (2) with a flat work surface provided with outlet openings (7) for the treatment liquid is suitable for carrying out the method. During the preparation, the preparation liquid is pressed under the base plate (4) into the moving polishing cloth (2) so that the area through which it flows is gradually passed through.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0692318-A1
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priorityDate 1989-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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