| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20ef5320b3fd261df7fe651f6c933537 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01039 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49572 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
1989-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_396b1f414bee8c66f0e5e0521c51cb58 |
| publicationDate |
1991-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0406373-A1 |
| titleOfInvention |
Tape automated bonded lead package and reusable transport tape for use therewith |
| abstract |
The invention relates to a housing of conductors comprising a rectangular structure (18, 28) made of insulating polymeric material, as well as a plurality of conductors (34) inserted in said structure and extending inside and outside inside and outside thereof, intended to be fixed to an associated integrated circuit and intended for fixing the integrated circuit with conductors to an associated printed wiring board or to a similar circuit. The insulation structure serves as a barrier or hermetic closure in an encapsulation process. An additional structure (29) stabilizes and positions the ends of the outwardly extending conductors (34). It also relates to a reusable transport and test film (12) comprising a plurality of conductors (62) suitable for receiving and connecting the conductors (34) from the conductor housing to the contact pads of the integrated circuit, and for moving the conductor box as well as the integrated circuit in successive treatment stations where the circuit is put in case and tested, then cut. |
| priorityDate |
1988-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |