| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0397
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-365
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-167 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-2435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-714
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-368 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 |
| filingDate |
1990-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49382867192b269c379b9c5aa59cb548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c232388fae7fa9dc58893170d182e5c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_506cf3707a669226fc2b8205b81a64e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e9f0c19577a20148a7a1dde234fa4c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d47f05ee581d5e5cbfd3b73474ae0ae |
| publicationDate |
1990-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0396523-A2 |
| titleOfInvention |
High density interconnect strip |
| abstract |
An interconnect strip is provided for effecting electrical interconnection between pluralities of conductor pads disposed on circuit boards or the like in a high density configuration. The strip is fabricated from a polymer film carrier (10,30) having laminated thereon a metal foil with preselected spring properties. After lamination, lithographic techniques form a series of electrically isolated metallic beams (20) on the carrier. Additional chemical processing removes portions of the carrier at opposing sides of the strip to expose opposing ends of the beams which extend beyond the carrier parallel to one another in opposing directions outwards from the carrier. By urging the pads towards respective beam ends of the strip disposed between the pads until mating engagement therewith, a plurality of electrical interconnections are established through the beams. Flexural properties of the strip provide a low insertion force connection for a high density of conductors wherein the spring action of the strip assures favorable contact forces to the pads. The exposed film side of the strip may also be metalized and provided with beams or interconnected to beams on opposing side of the film by vias thereby providing a ground plane. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0047025-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0635911-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19837217-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0635911-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0047025-A2 |
| priorityDate |
1989-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |