| abstract |
The characteristics of this invention are in particular the following: uniaxial arrangement '' one by one '' (40) with a conductive passage hole by connection position of the chips, test of '' mirror chips '', interconnection of the chips by heat dissipation , elimination of any contact with the conductive cleavage edge of the chips, solid indium columns, metal infiltrated into cavities (41) of the conductive passage hole. All these characteristics require materials (polyimide UPILEX) and techniques (laser ablation U.V., minimum taper of the holes) preferred. |