| abstract |
Polyamides suitable for use as hot melt adhesives, eg with polyepoxide resins can be prepared fromn 1. one or more polyoxyalkylene polyamines having an average molecular weight of 148 to 500, 2. a dimer acid having at least 36 carbon atoms, and 3. a short chain dicarboxylic acid. n The materials can be reacted at 170 to 280 o C in a mole ratio, total amine to acid, of 0.8:1.0 to 1.25:1.0. n The softening point and shear strength of the adhesive can be adjusted by adjusting the ratio of the reacting materials. |