| abstract |
A liquid, thermosetting composition is disclosed which contains (a) 10-70 % by weight of an epoxy resin, (b) 10-70 % by weight of a maleimide-triazine resin, (c) 5-60 % by weight of a polymerizable compound having at least two acrylate or methacrylate groups, and (d) 0.1-10 % by weight of a radical polymerization initiator, the amount of each of ingredients (a) through (d) being based on the total weight of ingredients (a) through (c). The composition gives a solid, thermosetting resin when heated at a low temperature or when irradiated by actinic light by reaction of ingredients (c) and (e), and the solidified resin in turn affords a cured resin having good moisture-proofing and insulting properties when heated at a high temperature by reaction of ingredients (a) and (b). |