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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-46
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-46
filingDate 1989-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1995-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91e9a714c21e6a2d27b4c2eff031e135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9655a4c5875d764fea20b145b9098e81
publicationDate 1995-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0377080-B1
titleOfInvention Electrical conductor with polymeric insulation
abstract Process for joining a completely thermally cured polymer to itself or to another material by coating the polymer with an adhesive layer of a completely thermally cured organosiloxanimide adhesive which contains an organic peroxide, and curing the adhesive by heating in order to crosslink it. The polymer used may be a polyimide, a polyphenylene sulphide or a polyether ether ketone. A heat-resistant and solvent-resistant polymer-insulated wire is obtained.
priorityDate 1988-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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