| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4aefb306d25a71b08bb9414cdb92efb3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
1989-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1387321e606ca56fbe61e21e5f23b44e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9216b8d29d6101adc2fd4c156b20866a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fa3f3b110b0d1ebc6a9c50126bf8f58 |
| publicationDate |
1990-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0372017-A1 |
| titleOfInvention |
PREPARATIONS BASED ON EPOXIDE RESINS FOR SEALING SEMICONDUCTOR CIRCUITS. |
| abstract |
Preparations based on epoxy resins essentially comprising (A) multifunctional epoxy resins, (B) silicone compounds modified with an imide, (C) novolaks having more than 2 OH groups and (D) inorganic charges. Once vulcanized, these preparations have excellent machinability and less internal stress compared to a similar preparation devoid of silicone compounds modified by an imide. These preparations are useful for sealing semiconductor circuits and in other molding applications. |
| priorityDate |
1988-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |