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filingDate 1989-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d34912b76e921a686b019b847219d334
publicationDate 1990-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0371147-A1
titleOfInvention Abrasive composition for silicon wafer
abstract Yhe invention relates to a composition for polishing silicon wafers to be used as supports of electric integrated circuits, which contains modified colloidal silica sol obtained by modifying part of silanol groups on the surface of silica particles of colloidal silica sol with trialkylsilane.
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priorityDate 1988-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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