| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5202091df9de019fc995f2d266f9ecc2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 |
| filingDate |
1988-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ced73f3b2b3e48b83117b927553e6a39
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1f4e0575d16eda2c1ddd1a0fb43967a |
| publicationDate |
1990-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0366711-A1 |
| titleOfInvention |
SEMICONDUCTOR PACKAGE. |
| abstract |
Hermetic semiconductor package (10) for an electrical component (26) with a metal or metal alloy mounting frame (18). The mounting frame (18) is connected by means of fired glass or ceramic (24), to an element (12) serving as a base. The element (12) serving as a base is covered with a relatively thin metal or metallic alloy coating (40) on at least the upper surface of the sides thereof, the coating comprising, on its outer surface (42 ) an advantageous refractory oxide layer. The mounting frame (18) is also linked to a metal or metal alloy cover element (30). The coating (40) on the element (12) serving as a base allows the use of a element (12) serving as a base having undesirable characteristics of oxide formation. The thinness of the coating (40) improves the heat transfer, and the oxide layer on the sides of the element (12) serving as a base ensures the connection in case glass (24) overflows from the edge of the base during heating, glass which could break or flake off. |
| priorityDate |
1987-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |