Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2973a1bdaf87d5184fb1e81ebe5d061 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-42 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-42 |
filingDate |
1989-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1995-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_795d0ea6e30a7536764913b851aeea63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_609b7b9de1a39c2f9e091a0b59c15240 |
publicationDate |
1995-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0353933-B1 |
titleOfInvention |
Sealing resin composition for electronic component and electronic component |
abstract |
A sealing resin composition is useful for an electronic component and comprises a melt-processable polyester which has a weight-average molecular weight of 1000 to 3900 and can form an optically anisotropic molten phase and at most 80% by weight (based on the total amount of the composition) of an inorganic powder surface-treated with an epoxy- or mercapto-silane coupling agent. |
priorityDate |
1988-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |