| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2973a1bdaf87d5184fb1e81ebe5d061 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 |
| filingDate |
1989-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_609b7b9de1a39c2f9e091a0b59c15240
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_795d0ea6e30a7536764913b851aeea63 |
| publicationDate |
1990-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0353933-A2 |
| titleOfInvention |
Sealing resin composition for electronic component and electronic component |
| abstract |
A sealing resin composition is useful for an electronic component and comprises a melt-processable polyester which has a weight-average molecular weight of 1000 to 3900 and can form an optically anisotropic molten phase and at most 80% by weight (based on the total amount of the composition) of an inorganic powder surface-treated with an epoxy- or mercapto-silane coupling agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012015788-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8383716-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0002975-A1 |
| priorityDate |
1988-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |