abstract |
A resin composition or a solder resist resin composition which comprises (A) an epoxy resin and/or (B) epoxy acrylate obtained by reaction 1 chemical equivalent of the epoxy group of an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, (C) a copolymer of styrene with maleic anhydride, (D) an unsaturated compound other than compound (B), and (E) a photopolymerization initiator. |