| abstract |
Disclosed herein is a low-shrinkage thermosetting resin composition which comprises a thermosetting resin and a polymer having in its molecule a functional group such as aziridine group, oxazoline group, and epoxy group. It undergoes only a small amount of volume shrinkage at the time of curing. This low shrinkage leads to superior dimensional stability, surface smoothness, and crack resistance. It provides molded articles free of discoloration and having a good surface gloss, without causing mold staining. |