| abstract |
Miscellaneous UNIAX concepts. n The present concepts include "1:1" uniax (40) with one conductive through-hole per chip connection site, "mirror chip" testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subÂject to preferred materials (UPILEX polyimide) and techÂniques (U.V. laser ablation, minimum taper of holes). |