http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0322228-A2

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filingDate 1988-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d380110419ed92464328a32b741fa3e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4b5b18542c9213c51b969d38b7e0a76
publicationDate 1989-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0322228-A2
titleOfInvention Large array thermal ink jet printhead
abstract A large array ink jet printhead is disclosed having two basic parts, one containing an array of heating elements and addressing electrodes on the surface thereof, and the other containing the liquid ink handling system. At least the part containing the ink handling system is silicon and is assembled from generally identical sub-units (22) aligned and bonded side-by-side on the part surface having the heating element array. Each channel plate sub-unit has an etched manifold (27) with means (25) for supplying ink thereto and a plurality of parallel ink channel grooves (36) open on one end and communicating with the manifold at the other. The surfaces (23) of the channel plate sub-units contacting each other are {111} planes formed by anisotropic etching. The channel plate sub-units appear to have a parallelogram shape when viewed from a direction parallel with and confronting the ink channel groove open ends. The heating element array containing part may also be assembled from etched silicon sub-units with their abutting surfaces being {111} planes. In another embodiment, a plurality of channel plate sub-units are anisotropically etched in a silicon wafer and a plurality of heating element sub-units are formed on another silicon wafer. The heating element wafer is also anisotropically etched with elongated slots. The wafers are aligned and bonded together, then diced into complete printhead sub-units which have abutting side surfaces that are {111} planes for accurate side-by-side assembly.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5896150-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5760804-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9117891-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03022584-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0600382-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9704963-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9117051-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4031192-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7090325-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4020886-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6155677-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9822289-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0376514-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0656261-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0600382-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0656261-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5959643-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0376514-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7731861-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3299149-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6014153-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6309057-B1
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