| abstract |
A water-based contact adhesive composition, especially suited for high modulus laminates subjected to high temperature post-forming, comprising an aqueous medium containing 45 to 85 wt% adhesive component consisting essentially ofn (a) 50-99 wt% vinyl acetate-ethylene emulsion copolymer of 10-50 wt% toluene insolubles and -20 to 10°C Tg, and preferably prepared by the emulsion polymerization of vinyl acetate and ethylene in the presence of a suspending system consisting essentially of polyvinyl alcohol and a nonionic polyethoxylated surfactant, the emulsion being at least 60% solids, (b) up to 30 wt% plasticizer, and (c) 0-20 wt% phenolic or polyester thermosetting resin. |