| abstract |
A polyamide composition comprising an aromatic ring-containing polyamide resin and a specific amount of an aliphatic polyester. The composition has improved molding properties, such as mold release characteristics, and exhibits excellent physical properties, such as stiffness, which will not be lowered upon contact with moisture. The polyamide composition may contain additional components which have been used to improve properties other than molding properties, such as Izod impact strength and hinge effect properties, so that the effects of the components are also exerted in the present composition without sacrificing the main effect aimed at by the present invention, i.e., excellent molding properties. Therefore, the polyamide composition of the present invention is useful as a molding material in various fields, e.g., automobile, electrical and electronic industries. |