http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0318169-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b73bb5b611ad02b686a7967bc6ca3412 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-526 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-526 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 |
| filingDate | 1988-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42a0d5817c6542dbaaf0cc3ebf1ed822 |
| publicationDate | 1989-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0318169-A2 |
| titleOfInvention | Phosphite modified epoxy resin |
| abstract | This invention relates to adhesives, and more particularly, epoxy adhesives. n The automotive industry has used sheet molding compound (SMC) for manufacture of parts for automobile bodies. Sheet molding compound typically comprises specialty thermosetting polyester resins, reinforcing fibers, thickeners to increase the viscosity of the resin and to facilitate handling, catalysts to cure the resins, filler to lower cost, improve the surface, or add specific properties, mold release agent, and pigment. n Thermoplastic copolymers have been incorporated in sheet molding compound in an effort to improve the appearance of painted SMC automobile components. The use of thermoplastic copolymers in SMC formulations has resulted in severe bonding problems for conventional repair adhesives. At present, there are no after market adhesives suitable for repairing parts made of SMC. n This invention provides a composition comprising an epoxy resin, an adduct of a tetra-substituted titanate and a di-substituted hydrogen phospite, a neutral ester of a phosphorous acid, and a curing agent for the epoxy resin. n The composition is particularly useful as an adhesive for bonding structures made of sheet molding compound to like structures, to steel, and to other substrates commonly used in the automotive area. |
| priorityDate | 1987-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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