| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-20 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M5-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
| filingDate |
1988-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1990-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0316886-A3 |
| titleOfInvention |
Printed circuit board manufacturing method |
| abstract |
A printed circuit board manufacturing method which uses a thermal transfer ink nribbon (R) prepared by coating a film (2) with a thermoplastic layer (1) of ink having a selected thickness and including a nconductive filler such as carbon black (F) mixed and dispersed in a thermoplastic vehicle (V). The thermal transfer ink ribbon n(R) is pressed upon a substrate (B) base by a heating head (4) having fine dots (3), with the fine dots (3) heated nselectively. The thermoplastic ink layer (2) is thereby fused or softened for transfer to the substrate base (B) and forming a ncircuit pattern on the substrate base (B). |
| priorityDate |
1987-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |