http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0316886-A2

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filingDate 1988-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1989-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0316886-A2
titleOfInvention Printed circuit board manufacturing method
abstract A printed circuit board manufacturing method which uses a thermal transfer ink ribbon (R) prepared by coating a film (2) with a thermoplastic layer (1) of ink having a selected thickness and including a conductive filler such as carbon black (F) mixed and dispersed in a thermoplastic vehicle (V). The thermal transfer ink ribbon (R) is pressed upon a substrate (B) base by a heating head (4) having fine dots (3), with the fine dots (3) heated selectively. The thermoplastic ink layer (2) is thereby fused or softened for transfer to the substrate base (B) and forming a circuit pattern on the substrate base (B).
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