| abstract |
A temporary mask composition comprising: (1) a radiation curable monomer including a predominant amount of acrylic and capped prepolymer, (ACRYL)m-X, (2) a radical photoinitiator, (3) an adhesion reducing component selected from the group consisting of: (i) acrylic esters of fatty alcohols (I); (ii) vinyl esters of fatty acids (II) and (iii) monoacrylic esters of polyalkylene oxides (III) where ACRYL= (IV), x = a polymer residue or backbone, m > 2, n > 9, o > 8, p > 3, R = H or alkyl. A method for providing temporary masking of electronic components compatible with a high speed production operation is also disclosed. Suitably the adhesion of the cured composition (22) to the substrate (16) as measured in the tensile shear mode, is between about 5 to 55 psi. This level of adhesion is sufficient to prevent ingress of solvent solder, plating or coating materials but low enough to allow easy dry stripping mechanically or by hand. |