| abstract |
A vaporizing apparatus 71 delivers precisely controlled, substantially continuous and monitored vapor flows for uses such as in plasma enhanced vapor deposition. The vaporizing apparatus comprises a fluid passageway 212 along which are a pumping means 220, a vaporizing means 226 and a flowing means 260 all in fluid communication with the passageway. The vaporizing means 226 vaporizes liquid pumped from the pumping means 220 and includes a heat sink layer 228, a heated layer 234, and a portion 212a of the passageway sandwiched therebetween. The vaporizing apparatus 71 can sustain a floe of organosilicon vapor at a flow rate of about 1 to about 100 SCCM for as long as desired. |