Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-259 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate |
1988-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1993-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1993-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0285450-B1 |
titleOfInvention |
Epoxy resin composition and a resin-sealed semiconductor device |
priorityDate |
1987-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |