Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
filingDate |
1987-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa7b085172c0ea0fd9c5b76047211a0f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_709371d4ea1e0eb1ba60125f262af209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31a3974ad4571dca1b6f79111032e6d4 |
publicationDate |
1988-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0273376-A1 |
titleOfInvention |
Embedded catalyst receptors for metallization of dielectrics |
abstract |
The invention is directed to a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprisesn a. an electrically insulative substrate bearing b. an adherent layer of crosslinked polymeric adhesive, which is insoluble in photodielectric developing solutions, having partially embedded therein finely divided particles of adsorbent which protrude from the adhesive surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof, and c. a solid layer of photodielectric adherently overlying the layer of adhesive and adsorbent particles. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1976352-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1976352-A4 |
priorityDate |
1986-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |