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filingDate 1987-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d4a0b6ce3f6864c9e4dc6e10b6faf3c
publicationDate 1988-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0272990-A1
titleOfInvention Ceramic combined cover for a semiconductor package
abstract A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.
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priorityDate 1986-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 35.