http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0263129-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 |
| filingDate | 1987-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1993-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0263129-B1 |
| titleOfInvention | Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof |
| abstract | A process for preparing an epoxy resin and a process for preparing a hardened and cured epoxy resin adhesive, together with the epoxy resins and adhesives made thereby. The epoxy resin is prepared by mixing together about 76 parts per hundred of a novolac epoxy resin, about 19 parts per hundred of a bisphenol F epoxy resin, and about 5 parts per hundred of carboxy-terminated butadiene acrylonitrile, heating the mixture to a temperature of from about 290 to about 350 degrees Farhrenheit for a time of from about two to about three hours, and then cooling. An epoxy adhesive is prepared by mixing 100 parts of the material so prepared with about 20 parts of a curing agent consisting essentially of diethyltriamine. The resulting adhesive mixture has a paste-like consistency that is easily applied and cured at ambient temperature. The shear strength of the cured adhesive is about 4000 psi at ambient temperature and about 2000 psi at 250 degrees Fahrenheit. The cured adhesive has excellent peel strength, indicating ductility and toughness. It also exhibits acceptably low levels of particle outgassing, permitting its use in spacecraft applications. |
| priorityDate | 1986-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.