http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0259727-A2
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-146 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
filingDate | 1987-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b87e931d8956b93cfdce63ecd5b8df47 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c76e23d9c1f78066cff9e436e727f04e |
publicationDate | 1988-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | EP-0259727-A2 |
titleOfInvention | Process for obtaining heat-resistant structural layers based on epoxy resins |
abstract | Heat-resistant structured layers can be - by applying radiation-sensitive soluble polymers in the form of a layer or film on a substrate, irradiating the layer or film with negative templates with actinic light or by guiding a light, electron, laser or ion beam, removing the - irradiated layer or Film parts and optionally by subsequent tempering - then produce in a cost-effective manner, dimensionally accurate and in high quality form, in a single coating process if photopolymers based on epoxy resin are used in the form of addition products of olefinically unsaturated monoisocyanates with hydroxyl-containing epoxides. The layers produced by this process also withstand the thermal and mechanical stresses during dip soldering processes and effectively and permanently protect circuit surfaces against moisture and corrosion; They are therefore particularly suitable as a solder stop and insulation layer in fine conductor technology. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0259726-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0259726-A2 |
priorityDate | 1986-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 121.