http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0259723-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-143 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-28 |
| filingDate | 1987-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c76e23d9c1f78066cff9e436e727f04e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b87e931d8956b93cfdce63ecd5b8df47 |
| publicationDate | 1988-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0259723-A2 |
| titleOfInvention | Process for obtaining heat-resistant structural layers |
| abstract | Heat-resistant structured layers can be - by applying radiation-sensitive soluble polymers in the form of a layer or film on a substrate, irradiating the layer or film with negative templates with actinic light or by guiding a light, electron, laser or ion beam, removing the - irradiated layer or Film parts and optionally by subsequent annealing - then produce in a cost-effective manner dimensionally accurate and in high quality form, in a single coating process if photopolymers in the form of addition products of olefinically unsaturated monoisocyanates with phenol-formaldehyde resins are used. The layers produced by this process also withstand the thermal and mechanical stresses during dip soldering processes and effectively and permanently protect circuit surfaces against moisture and corrosion; They are therefore particularly suitable as a solder stop and insulation layer in fine conductor technology. |
| priorityDate | 1986-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 129.