| abstract |
Mixtures of substances which can be used as adhesives, sealants, laminating resins and coatings contain (a) an epoxy resin, (b) a nitrogen-containing latent hardener for the resin, such as e.g. Dicyandiamide or isophthalic acid dihydrazide, and (c) as a curing accelerator and in powder form distributed in (a) and (b), a reaction product of a nitrogen base and a halogen-substituted monomeric phenol. Typical nitrogen bases used for the production of (c) are e.g. N, N-dimethyl-1,3-propanediamine, 2,4,6, -Tris (dimethylaminomethyl) phenol and 2-methylimidazole. Typical halogen substituted phenols are e.g. 2,4,6-trichlorophenol, 2,4,6-tribromophenol, tetrachlorobisphenol A and tetrabromobisphenol A. |