| abstract |
A novel epoxy resin encapsulating composition comprising a blend of a suitable epoxy resin, curing agent thereof, and reaction product of silicon compounds having different functional groups which are reactive with each other and with the epoxy resin or the curing agent employed. Preferred silicon compounds are epoxy, amino, hydroxyl, and carboxyl groups. The incorporation of the silicon reaction product is responsible for the reduction in the internal stress developed in the resulting encapsulation or package without lowering the moisture resistance of the package, greatly improving the mechanical and electrical properties of the package. |