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filingDate 1986-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c66ae78bde17f4b39add5e98b0f71420
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publicationDate 1987-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0216919-A1
titleOfInvention METHOD AND TARGET FOR DEPOSITING THIN FILM BY SPRAYING.
abstract A sputtering target (176) includes a sputtering surface having first and second areas (208, 206) of first and second respective materials. The first area (208) includes a surface of a first member (208) made of the first material, such as a circular cobalt plate. The second area (206) includes a surface of a second member (206) made of the second material, such as a platinum ring. A cobalt cover ring (210) clamps the platinum ring (206) on the cobalt plate. By modifying the relative size of the first and second zones (208, 206), for example by modifying the dimensions of the cover ring (210) so as to more or less expose the platinum ring (206), the concentration of the two materials in a layer deposited from the target (176) on substrates (260) varies. In addition, by imparting a planetary movement to the substrates (260) during the deposition process, and adjusting the dimensions and position of the exposed portion of the platinum ring (206), a gradient of radial coercivity in the layer is established. deposited on the substrates (260).
priorityDate 1985-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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