| abstract |
Disclosed is a thermoplastic resinous composition having excellent molding properties comprising ;n (A) 100 parts by weight of an ABS resin, and (B) 0.5-10 parts by weight of a copolymer consisting of (a) 0.1-10 percent by weight of an acrylate or methacrylate containing epoxy groups, hydroxyl groups or alkoxy groups, (b) 20-99.9 percent by weight of an alkyl acrylate not containing epoxy groups, hydroxyl groups or alkoxy groups, and (c) 0-79.9 percent by weight of other copolymerizable vinyl compounds. |