| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9645c93d8b03402c48ccef98d92e8f8f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4807 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 |
| filingDate |
1986-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_220399acf3a13d5b56ea807e1a101457 |
| publicationDate |
1987-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0214916-A1 |
| titleOfInvention |
Process for making an interconnection substrate for electronic components |
| abstract |
According to the invention, the dielectric of the substrate is a cordierite type ceramic, the very low relative dielectric constant of which enables use at microwave frequencies.n n n In a first embodiment, the dielectric is prepared from a powder sintering at approximately 980 °, allowing the use of silver (in the case of sintering in an oxidizing atmosphere) or copper (in the in the case of sintering in a reducing atmosphere) for the conductive patterns ensuring the interconnections.n n n In a second embodiment, cordierite sintered at around 1350 °; the metallizations are then based on palladium (in the case of an oxidizing atmosphere) or molybdenum or tungsten (in the case of a reducing atmosphere). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5287620-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0312824-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0463872-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0463872-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0312824-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5286927-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0519676-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0519676-A2 |
| priorityDate |
1985-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |