| abstract |
Metallized polymer compositions are disclosed, the surface of which comprises a combination of a metal element A (Sn, As, Sb or Bi) and a metal element B (Fe, Co, Ni, Cu, Zn, Ga, Ru, Rh, Pd, Ag, Cd or In), preferably an intermetallic compound of antimony and a metal element B. Processes for producing such metallized polymer compositions involve either the reduction of a metal element A compound in the presence of metallic metal element B and the polymer or the compression of a laminate of antimony and metal element B layers onto the polymer. The metallized polymers are useful in the production of printing circuit board, electromagnetic interference shielding devices, membrane switches, capacitors, conductive fibers, magnetic tapes and discs, anti-static mats, barrier polymers or optical storage devices. |