Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1868 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
filingDate |
1985-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1986-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0182193-A3 |
titleOfInvention |
A method of depositing a copper pattern on a substrate |
priorityDate |
1984-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |