Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7ad58d3c0b071069a8ee0cb8c8ba2e8 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31699 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
filingDate |
1985-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11ae9a0d17c1cd0f195acbae9a8dabca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_777cb712e0bfb223b44d624cd747923c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3540452a15907363503f9369d82afc45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90ccb9ede498b5469f5e17b6cf511644 |
publicationDate |
1986-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0177862-A2 |
titleOfInvention |
Half-finished products for the production of printed circuit boards |
abstract |
Carrier materials on which complex compounds are built up in which the ligands and the ions to be complexed have a “host-guest interrelation” are ideally suited for the currentless metallization of base carriers for the production of printed circuit boards. Examples of such activator compounds are complexes of crown ethers, cryptands and the like. Like. The resulting printed circuit boards are characterized by high adhesive strength of their metal layers. |
priorityDate |
1984-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |