http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0170767-A2

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filingDate 1985-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1986-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0170767-A2
titleOfInvention Substrate for printed circuits
abstract Suitable substrates for the baking of printing pastes up to about 980 ° C for the production of printed circuits consist of a layered composite material made of temperature-resistant metal and BaO-Al2O3-SiO2 glass ceramic. These substrates are well suited for applications in which they are subject to vibrations (e.g. automotive electronics) and where large substrates are required.
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