| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-40 |
| filingDate |
1985-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_964a8a7925a51f1f5920c1e063ba0a08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8191a57b096010dc11689e6eafbc6e44 |
| publicationDate |
1986-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0167033-A2 |
| titleOfInvention |
Apparatus for conduction cooling |
| abstract |
Disclosed is a device to thermally couple a heat dissipating intergrated circuit chip to the heat sink in a thermal conduction module for effective cooling of the chip by minimizing the thermal resistance path from the chip to the sink. The device is a combination of a heat conducting flat based, truncated solid conical disc (23) which is spring (26) loaded on the back of the chip (20) and a heat conductive hat member (27) having an opening with a continuous tapered wall (28) to conformally fit over the truncated conical disc (23). The gap between the disc (23) and the hat (27) is packed with a thin layer of a high thermal conductivity grease (33) to provide a low interfacial thermal resistance and mechanical flexibility between the disc (23) and the hat (27). For additional cooling enhancement of the chip (20), at the interface between the chip back surface and the base of the disc (23) a self-healing alloy (34) having a high thermal conductivity and low melting point is provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0402106-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0402106-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0241290-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5130832-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0288183-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4404035-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0288183-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9313923-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19612259-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0460389-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0667737-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-3927755-A1 |
| priorityDate |
1984-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |