| abstract |
A resin composition for a molding material is provided which comprises a resol-type phenolic resin, an epoxy resin and an amine compound having hydrogen atoms directly bonded to the nitrogen atom. The amine compound is contained in such a proportion that the amount of its hydrogen atoms directly bonded to the nitrogen atom is 0.5 to 2.0 equivalents per equivalent of the epoxy groups of the epoxy resin. |