| abstract |
A method for producing a multilayer ceramic circuit board includes the steps of forming a multilayer structure consisting of glass-ceramic layers and patterns of copper-based paste, the glass-ceramic layers consisting of a mixture of 10 per cent to 75 per cent by weight of α-alumina, 20 per cent to 60 per cent by weight of crystallisable or noncrystallisable glass which can be sintered at a temperature lower than the melting point of copper, and 5 per cent to 70 per cent by weight of quartz glass, based on the total weight of the glass-ceramic material present, blended with a binder containing a thermally depolymerisable resin; prefiring the multilayer structure in an inert atmosphere containing water vapour, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature at which the thermally de-. polymerisable resin is eliminated from the structure; and firing the multilayer structure in an inert atmosphere containing no water vapour at a temperature below the melting point of copper so as to sinter the glass-ceramic layers. |