| abstract |
A photo-detector array module (12) which comprises a stack of semiconductor chips (14) having integrated circuitry on each chip. To permit the emplacement of photo-detectors (28) on the focal plane end (16), and of thin film circuitry (30) on the back plane end, each plane is etched to cut back the semiconductor material, then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips. |