| abstract |
Heat-curable mixtures comprising (a) an epoxy resin with on average more than one epoxy group in the molecule, (b) an allyl- or methallyl-substituted imide of the formula I <IMAGE> in which E, G, n and R have the meaning given in claim 1, and (c) a curing catalyst, have good storage stability and processability and give molded materials with high mechanical strengths and good thermal stability. |