Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0397 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0394 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4084 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
filingDate |
1984-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1990-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1990-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0144943-B1 |
titleOfInvention |
Process using plasma for forming conductive through-holes through a dielectric layer |
priorityDate |
1983-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |