| abstract |
Metallized substrate surfaces, in particular printed circuit boards for printed circuits, can be obtained in an advantageous manner by using homogeneously distributed organometallic compounds of elements of the 1st and 8th subgroups of the periodic system according to the "ink-mist" or "inkjet" process on the Applies carrier plates and, after sensitization, the substrates pretreated in this way are immediately introduced into an electroless metallization bath. |