Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a1cd7029ec038fa78d4b371f9bf08e9e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49805 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
filingDate |
1983-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_752a9f4366eb0cf38ee7efad47e98a8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36688e70d271957e406264b57b7c0110 |
publicationDate |
1984-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0123692-A1 |
titleOfInvention |
Leadless chip carrier for logic components |
abstract |
Support device (40) for mounting logic components on the surface of a printed circuit board (41). The support device (40) includes an enclosure structure defining top and bottom surfaces as well as a cavity (50) in the bottom surface for receiving a logic component (51). A recessed cover portion (56) is attached to the enclosure so as to close the cavity (50), thereby effectively enclosing the logic component (51) in the enclosure. The support device (40) includes means for mounting the enclosure on a printed circuit board so that the cover (56) is not in contact with the surface of the printed circuit board (41). The enclosure further includes members for electrically connecting the logic component (51) to the printed circuit board (41). In another embodiment, a support device (100) for mounting logic components on the surface of a printed circuit board (41) uses ground and voltage planes with an alternating signal (118) and AC power lines (121) to provide coplanar / parallel band and coplanar / microstrip transmission line environments along portions of the signal lines (118). Consequently, this makes it possible to obtain signal lines having a controlled impedance environment and a minimized crosstalk rate between neighboring signal conductors located in the same plane. |
priorityDate |
1982-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |