| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e9d511280da10a58db3eeb82cff49a67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
| filingDate |
1983-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9609681a0554003884174fccd4bbd403 |
| publicationDate |
1984-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0123689-A1 |
| titleOfInvention |
MICROCIRCUIT PACKAGE AND SEALING METHOD. |
| abstract |
A microcircuit package (10) and a sealing method in which a non-organic coating (34) is used to hermetically seal the microcircuit (16). The microcircuit (16) is insulated to protect the microcircuit (16) from the high temperatures required by the application and polymerization of a non-organic coating (34). The materials and methods used to insulate the microcircuit (16) are chosen so that the thermal coefficients of the materials are complementary and thus form a durable and very secure sealing joint, while also insulating the microcircuit (16) during the method of applying the inorganic coating (34). |
| priorityDate |
1982-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |