| abstract |
In a process for producing heat-treated wholly aromatic polyamide filaments comprising at least one wholly aromatic polyamide having recurring units of the formula (I) :n and at least one type of recurring units selected from those of the formula (III) :n where Ar represents a divalent aromatic radical selected from those of the formulae (III) and (IV):n n and R', R 2 , R 3 , R 4 , R 5 , R 6 and R 7 respectively represent independently from each other, a substituent selected from the group consisting of halogen atoms and alkyl radicals having 1 to 2 carbon atoms, and I, m, n, p, q, r, and s respectively represent, independently from each other, zero or an integer of 1 to 2, the sum of the recurring units of the formulae (I) and (II) corresponding to at least 80 molar% of the overall recurring units in the wholly aromatic polyamide, undesirable adhesion of individual filaments to each other is satisfactorily prevented by adhering fine particles of an inert inorganic material which consists essentially of at least one member selected from the group consisting of graphite, talc, colloidal silica, hydrophobic silica, and mica, and optionally, of hydrated aluminum silicate, to peripheral surfaces of the individual non-heat treated filaments and thereafter, by heat treating under tension or drawing the filaments. |