http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0114687-A2

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filingDate 1984-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1984-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0114687-A2
titleOfInvention Heat insulation slab with an envelope and highly dispersed particulate heat insulation material compressed in the envelope, method of manufacturing it and device for carrying out the method
abstract A thermal insulation board made of microporous insulating material (2) based on microporous silica airgel is provided with a covering (1) in the form of a composite film (1a), in which the powdery insulating material (2) is pressed into the form of a board. The composite film consists predominantly of an inexpensive material such as paper as the inner layer (21), which, however, has a lower flash point than the usual operating temperatures of more than 500 ° C. and would therefore burn when heated with a strong development of smoke and odors. The outer layer (22) of the composite film (1a) is formed by a few µm thick aluminum foil, which ensures that the paper behind it is air-sealed so that it cannot burn, but only cracks. For the at. The area of the seams (4, 5), which are air-permeable at wide stitch spacings, is used in particular for the necessary air outlet. In addition, perforations (24) can be introduced into the composite film (1a), which, due to the small hole diameter, do not allow thermal insulation material (2) to escape during pressing. With a correspondingly small hole diameter of the perforations (24), there is no clawing effect between the insulating material (2) and the covering (1), so that the thermal insulation board can be bent easily.
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